封装设计 30-50万

JOB DESCRIPTION:

1.Package design feasibility study to provide the more competitive package solution; Co-work with R&D team to optimize and generate the Bump map and Ball map.

2.Responsible for completing package designs; review the design files with subcon and substrate vendor; generate the package simulation model.

3.Optimize the assembly process and substrate built process to improve yield, reliability and cost saving.

4.Periodically survey the assembly technology and substrate build technology to update design rule.

 

QUALIFICATIONS:

1.Education: Bachelor Degree or above,  Master is preferred. Major in microelectronics, material etc.

2.Skillful in PCB or Substrate design tool.

3.Have basic understanding about electromagnetic field, thermal and mechanical.

4.Knowledge about semi-conductor process is a plus.

云计算芯片公司，主要产品DDR